[ Back ] [ Home ] [ Up ] [ Next ]

ANSWERS TO QUESTIONS Q1. THROUGH Q33.

A1. Lack of adequate storage space.
A2. Open filaments.
A3. Testing the tube in its circuit.
A4. In their circuit.
A5. Restore it to serviceable condition by operating it temporarily at reduced beam voltage.
A6. Correct gain figure.
A7. Rugged design.
A8. Sensitive to heat and minor overloads.
A9. Any range setting that produces a current flow through the transistor that exceeds 1 milliamp (usually R x 1 range).
A10. 3,500 to 4,000 volts.
A11. 35 volts.
A12. For your own safety.
A13. Voltages and resistances.
A14. Greater than 10 to 1.
A15. Gate and anode.
A16. Current is allowed to flow in either direction.
A17. Solder suckers create an electrostatic charge capable of damaging a MOSFET.
A18. Low power consumption, compact size, and lower cost.
A19. ICs cannot be repaired. All you need to test is output versus input.
A20. A "1" or "0."
A21. A "1" state.
A22. A difference in logic states between the reference IC and the IC under test.
A23. They provide you with a visual indication of the logic state at any point you choose in the circuit.
A24. 10 feet.
A25. A battery test set will test batteries under load conditions.
A26. At 1.1 volts.
A27. Rf substitution method.
A28. Reading their resistances with a standard ohmmeter.
A29. High attenuation.
A30. It eliminates the need for multiple pieces of test equipment and it is lightweight and portable.
A31. Testing components by comparison.
A32. Some defective devices may appear to be good in certain ranges.
A33. A parallel resistor or diode of similar value.