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USE OF FLUX IN SOLDER BONDING
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Neets Module 14-Introduction to Microelectronics
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ANSWERS TO QUESTIONS Q1. THROUGH Q14.

2-21 SUMMARY This topic has presented information on the Miniature and Microminiature 2M Repair Program and high-reliability soldering. The information that follows summarizes the important points of this topic. The MINIATURE/MICROMINIATURE (2M) REPAIR PROGRAM provides training, tools and equipment, and certification for 2M repair personnel. CERTIFICATION of technicians ensures the capability of high-quality, high-reliability repairs. The three SM&R codes for maintenance of electronic devices are:  DEPOT (D), INTERMEDIATE (I), and ORGANIZATIONAL (O). SM&R CODE D MAINTENANCE is characterized by extensive facilities and highly trained personnel. Code D activities are capable of the most complex type repairs. CODE I activities provide direct support for user activities. This includes calibration, repair, and emergency manufacture of nonavailable parts. CODE O maintenance is the responsibility of the user activity. It includes preventive maintenance and minor repairs. ON-LINE TEST EQUIPMENT continuously monitors system performance and isolates faults to removable assemblies. OFF-LINE TEST EQUIPMENT evaluates removable assemblies outside of the equipment and isolates faults to the component level. FAULT ISOLATION USING GENERAL-PURPOSE ELECTRONIC TEST EQUIPMENT (GPETE) should only be attempted by experienced technicians. 2M REPAIR STATIONS are equipped according to the level of repairs to be accomplished. ALLOYS, such as solder, which change directly from a solid state to a liquid are called eutectic alloys. SOLDER with a tin/lead ratio of 63/37 is preferred for electronic work. A ratio of 60/40 is also acceptable. ROSIN or RESIN FLUXES are the only fluxes to be used in electronic work.

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