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PACKAGING TECHNIQUES | Up
Neets Module 14-Introduction to Microelectronics | Next
Flat Pack |
1-20
Figure 1-19.—Exploded TO-5.
Figure 1-20.—TO-5 package.
The modified TO-5 package (figure 1-21) can be either plugged into [view (A)] or embedded in
[view (B)] a board. The embedding method is preferred. Whether the package is plugged in or embedded,
the interconnection area of the package leads must have sufficient clearance on both sides of the board.
The plug-in method does not provide sufficient clearance between pads to route additional circuitry.
When the packages are embedded, sufficient space exists between the pads [because of the increased
diameter of the interconnection pattern, shown at the right in view (B)] for additional conductors.
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