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Neets Module 14-Introduction to Microelectronics | Next
INTRODUCTION |
1-1
CHAPTER 1
MICROELECTRONICS
LEARNING OBJECTIVES
Learning objectives are stated at the beginning of each topic. These learning objectives serve as a
preview of the information you are expected to learn in the topic. The comprehensive check questions are
based on the objectives. By successfully completing the OCC-ECC, you indicate that you have met the
objectives and have learned the information. The learning objectives are listed below.
Upon completion of this topic, you will be able to:
1. Outline the progress made in the history of microelectronics.
2. Describe the evolution of microelectronics from point-to-point wiring through high element
density state-of-the-art microelectronics.
3. List the advantages and disadvantages of point-to-point wiring and high element density state-of-
the-art microelectronics.
4. Identify printed circuit boards, diodes, transistors, and the various types of integrated circuits.
Describe the fabrication techniques of these components.
5. Define the terminology used in microelectronic technology including the following terms used
by the Naval Systems Commands:
a. microelectronics
b. microcircuit
c. microcircuit module
d. miniature electronics
e. system packaging
f. levels of packaging (0 to IV)
g. modular assemblies
h. cordwood modules
i.
micromodules
6. Describe typical packaging levels presently used for microelectronic systems.
7. Describe typical interconnections used in microelectronic systems.
8. Describe environmental considerations for microelectronics.
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