Appendix I - Continued

AI-2 EPITAXIAL PROCESS—The depositing of a thin uniformly doped crystalline region (layer) on a substrate. EUTECTIC ALLOY—An alloy that changes directly from a solid to a liquid with no plastic or semiliquid state. EUTECTIC SOLDER—An alloy of 63 percent tin and 37 percent lead. Melts at 361º F. FILM ICs—Conductive or nonconductive material deposited on a glass or ceramic substrate. Used for passive circuit components, resistors, and capacitors. FLAT PACK—IC package. FLIP CHIP—Monolithic IC packaging technique that eliminates need for bonding wires. FLUX—Removes surface oxides from metals being soldered. GENERAL PURPOSE ELECTRONIC TEST EQUIPMENT (GPETE)—Multimeters, oscilloscopes, voltmeters, signal generators, etc. GROUND PLANES—Copper planes-used to minimize interference between circuits and from external sources. HYBRID ICs—Two or more integrated circuit types, or one or more integrated circuit types and discrete components on a single substrate. INTEGRATED CIRCUIT (IC)—Elements inseparably associated and formed on or within a single substrate. INTERMEDIATE-LEVEL MAINTENANCE (SR&R Code I)—Direct support and technical assistance to user organizations. Tenders and shore-based repair facilities. ISOLATION—The prevention of unwanted interaction or leakage between components. LANDS—Conductors or runs on pcbs. LARGE SCALE INTEGRATION (lsi)—An integrated circuit containing 1,000 to 2,000 logic gates or up to 64,000 bits of memory. MASK—A device used to deposit materials on a substrate in the desired pattern. MICROCIRCUIT—A small circuit having high equivalent-circuit-element density, which is considered as a single part composed of interconnected elements on or within a single substrate to perform an electronic-circuit function. MICROELECTRONICS—That area of electronics technology associated with electronic systems built of extremely small electronic parts or elements. MICROCIRCUIT MODULE—An assembly of microcircuits or a combination of microcircuits and discrete components that perform one or more distinct functions. MODIFIED TRANSISTOR OUTLINE (TO)—IC package resembling a transistor.