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ANSWERS TO QUESTIONS Q1. THROUGH Q36. | Up
Neets Module 14-Introduction to Microelectronics | Next
Appendix I - Continued |
AI-1
APPENDIX I
GLOSSARY
ALLOWANCE PARTS LIST (APL)—Repair parts required for unit having the equipment/ component
listed.
ALLOWANCE EQUIPAGE LIST (AEL)—Equipment requirements for a unit having the exact
equipment/component listed.
BEAM-LEAD CHIP—Semiconductor chip with electrodes (leads) extended beyond the wafer.
BONDING WIRES—Fine wires connecting the bonding pads of the chip to the external leads of the
package.
BUILT-IN TEST EQUIPMENT (BITE)—Permanently mounted to the equipment for the purpose of
testing the equipment.
CABLE HARNESS—A group of wires or ribbons of wiring used to interconnect electronic systems and
subsystems.
CATHODE SPUTTERING—Process of producing thin film components.
CERMET—A combination of powdered precious-metal alloys and an inorganic material such as
alumina. Used in manufacturing resistors, capacitors, and other components for high-temperature
applications.
CORDWOOD MODULE.—A method of increasing the number of discrete components in a given
space. Resembles wood stacked for a fireplace.
CRYSTAL FURNACE.—Device for artificially growing cylindrical crystals for producing semi-
conductor substrates.
DEPOT-LEVEL MAINTENANCE (SM&R Code D)—Supports S&R Code I and SM&R Code O
activities through extensive shop facilities and equipment and more highly skilled personnel.
DICE—Uncased chips.
DIE BONDING—Process of mounting a chip to a package.
DIFFUSION—Controlled application of impurity atoms to a semiconductor substrate.
DISCRETE COMPONENTS—Individual transistors, diodes, resistors, capacitors, and inductors.
DOPING—See Diffusion.
DUAL IN-LINE PACKAGE (DIP)—IC package having two parallel rows of preformed leads.
ENCAPSULATED—Imbedded in solid material or enclosed in glass or metal.
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